ZX-X5 reballing manual soldering touch screen repair laptop ps xbox optic alignment bga rework station bga welding machine

1.BGA welding machine, 2.Touch screen, 3.Optic alignment, 4.English software, 5.Repair laptop PS xbox bga - details see: https://www.machineto.com/zx-x5-reballing-manual-soldering-touch-screen-repair-laptop-ps-xbox-optic-alignment-bga-rework-station-bga-welding-machine-10138290
Type:OtherPlace of Origin:Guangdong China (Mainland)Brand Name:ZhenxunModel Number:ZX-X5
Voltage:220VCurrent:10 ARated Capacity:4000 WRated Duty Cycle:350
Dimensions:L580*W830*H960mmWeight:95 KG,Approx. 95kgsUsage:remove and replace bga ,chipset,IC,QFN,CSP, QFP,POPPCB Size:Max L370*W350mm
PCB Thickness:0.1~5mmTemperature Control:K thermocouple PID Closed loopPCB Positioning mode:OuterBottom preheat:Infrared 2400 W
Top heater:800 WBottom heater:800 WPower supply:Single phase 220V,50/60Hz,4.0KVADimension:L580*W830*H960mm
ZX-X5 reballing manual soldering touch screen repair laptop ps xbox optic alignment bga rework station bga welding machine
contact supplier for ZX-X5 reballing manual soldering touch screen repair laptop ps xbox optic alignment bga rework station bga welding machine


ZX-X5 BGA rework station, bga welding machine

Features:

1. HD optical alignment system design,optical zoom up to 22 times;
2. Alignment fine-tuning accuracy can be 0.01mm;
3. PLC user interface control, display 4 temperature profile at the same time;
4. Upper heater with hot air to heat, bottom with hot air and IR to preheat;
5. Three independent heater with 9 segment temperature up(down)+9 segment constant control, can store 40 groups temperature profile;
6. Three heating zone with independent PID to control heating process, more stable and accurate;
7. After removal and welding, with cooling fan to cool PCB board, ensure welding effect;
8. Bottom heater and IR preheating zone with supporter to prevent welding zone part deformation;
9. Equipped with various size of hot air nozzle;
10. Upper and bottom heater can 360 degree rotation, easy to replace;
11. Build-in vacuum pump, no need gas source.

SPECIFICATION:

PCB SizeMax L370*W350mm
PCB Thickness0.1~5mm
Temperature ControlK Sensor Closed loop
Fine-tuning accuracy0.01mm
PCB PositioningOuter
Sub (Bottom) heaterInfrared 2400W
Main (Top) heaterHot air 800W+800W
Power SupplySingle phase 220V,50/60Hz,4.0KVA
Machine dimensionL580*W830*H960mm
Weight of machineApprox. 95kgs

ZX-X5 reballing manual soldering touch screen repair laptop ps xbox optic alignment bga rework station bga welding machine
Packaging Detail:Standard wooden package1 PC machine per one boxPackage size: L930 * W670 * H1080 mm Package weight: 135 KGS
Delivery Detail:1 day

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