ZX-X5 optic alignment bga rework station touch screen English software repair laptop ps xbox mobile phone smt

1.SMT, 2.BGA rework station ZX-X5, 3.Optic alignment, 4.Touch screen, English software, 5.Repair laptop PS Xbox3 bga pop qfn - details see: https://www.machineto.com/zx-x5-optic-alignment-bga-rework-station-touch-screen-english-software-repair-laptop-ps-xbox-mobile-phone-smt-10137968
Type:OtherPlace of Origin:Guangdong China (Mainland)Brand Name:ZhenxunModel Number:ZX-X5
Voltage:220VCurrent:10 ARated Capacity:4000 WRated Duty Cycle:350
Dimensions:L580*W830*H960mmWeight:95 KG,Approx. 95kgsUsage:remove and replace bga ,chipset,IC,QFN,CSP, QFP,POPPCB Size:Max L370*W350mm
PCB Thickness:0.1~5mmTemperature Control:K thermocouple PID Closed loopPCB Positioning mode:OuterBottom preheat:Infrared 2400 W
Top heater:800 WBottom heater:800 WPower supply:Single phase 220V,50/60Hz,4.0KVADimension:L580*W830*H960mm
ZX-X5 optic alignment bga rework station touch screen English software repair laptop ps xbox mobile phone smt
contact supplier for ZX-X5 optic alignment bga rework station touch screen English software repair laptop ps xbox mobile phone smt


ZX-X5 BGA rework station, smt

Features:

1. HD optical alignment system design,optical zoom up to 22 times;
2. Alignment fine-tuning accuracy can be 0.01mm;
3. PLC user interface control, display 4 temperature profile at the same time;
4. Upper heater with hot air to heat, bottom with hot air and IR to preheat;
5. Three independent heater with 9 segment temperature up(down)+9 segment constant control, can store 40 groups temperature profile;
6. Three heating zone with independent PID to control heating process, more stable and accurate;
7. After removal and welding, with cooling fan to cool PCB board, ensure welding effect;
8. Bottom heater and IR preheating zone with supporter to prevent welding zone part deformation;
9. Equipped with various size of hot air nozzle;
10. Upper and bottom heater can 360 degree rotation, easy to replace;
11. Build-in vacuum pump, no need gas source.

SPECIFICATION:

PCB SizeMax L370*W350mm
PCB Thickness0.1~5mm
Temperature ControlK Sensor Closed loop
Fine-tuning accuracy0.01mm
PCB PositioningOuter
Sub (Bottom) heaterInfrared 2400W
Main (Top) heaterHot air 800W+800W
Power SupplySingle phase 220V,50/60Hz,4.0KVA
Machine dimensionL580*W830*H960mm
Weight of machineApprox. 95kgs

ZX-X5 optic alignment bga rework station touch screen English software repair laptop ps xbox mobile phone smt
Packaging Detail:Standard wooden package1 PC machine per one boxPackage size: L930 * W670 * H1080 mm Package weight: 135 KGS
Delivery Detail:1 day

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