ZX-C2 three heater hot air IR manual repair laptop PS xbox bga rework station
Type:Other | Place of Origin:Guangdong China (Mainland) | Brand Name:Zhenxun | Model Number:ZX-C2 |
Voltage:220V | Current:10 A | Rated Capacity:4000 W | Rated Duty Cycle:300 |
Dimensions:L550*W530*H550mm | Weight:50 KG,Approx. 50kgs | Usage:remove and replace bga ,chipset,IC,QFN,CSP, QFP,POP | PCB Size:Max L330*W320mm |
PCB Thickness:0.1~5mm | Temperature Control:K thermocouple PID Closed loop | PCB Positioning mode:Outer | Bottom preheat:Infrared 2400 W |
Top heater:800 W | Bottom heater:800 W | Power supply:Single phase 220V,50/60Hz,4.0KVA | Dimension:L550*W530*H550mm |
ZX-C2 BGA rework station, SMD rework station
Features:
1.Using three independent temperature control, more accurate;
2.Upper and bottom heater using good material, can accurately regulate hot air flow and temperature , high temperature generated breeze, third with far infrared heating plate to preheat.
3.The first, second and third-zone with 8 segment temperature up (down)+8 segment constant temperature control, can store 10 groups temperature curve;
4.First zone and second start running temperature curve at the same time, third zone start running temperature rise and drop at the same time with first and second zone;
5.The first-, second-zone with over temperature protection design;
6.After remove and welding, using high-volume fan to cool the PCB board, prevent deformation of PCB board and ensure the effect of welding;
7.The first temperature zone can be front and back, up and down adjustment and 360-degree rotation, convenient to operate;
8.The second temperature can adjust according to different PCB board appearance and components, prevent collision with PCB lower plate components;
9.The third zone can be moved right and left, suitable to repair large BGA,CBGA and BGA in partial side of PCB board;
10.Equipped with a variety size of hot-air nozzle, or made according to special requirements, free rotation of hot air nozzles;
11.Adjustable PCB jaw, to prevent collision with the components;
12.Adjustable high-temperature resistance bracket, position rack designed to protect against hot;
13.After BGA remove and welding have voice alarm function;
14.Hand-held vacuum suction pen take BGA, convenient reliable and durable
PCB Size | Max L330*W320mm |
PCB Thickness | 0.1~5mm |
Temperature Control | K thermocouple PID Closed loop |
PCB Positioning mode | Outer |
Bottom preheat | Infrared 2400W |
Main (Top+bottom) heater | Hot air 800W+800W |
Power supply | Single phase 220V,50/60Hz,4.0KVA |
Dimension | L550*W530*H550mm |
Weight | Approx. 50kgs |
Packaging Detail:Standard wooden package1 PC machine per one boxPackage size: L660 * W620 * H700mm Package weight: 60KGS |
Delivery Detail:1 day |