ZX-1600 automatic optic alignment bga rework station touch screen repair pop qfn qfp solder paste

1.Solder paste, 2.BGA rework station ZX-1600, 3.Automatic, 4.Optic alignment, 5.Repair laptop PS Xbox3 bga pop qfn - details see: https://www.machineto.com/zx-1600-automatic-optic-alignment-bga-rework-station-touch-screen-repair-pop-qfn-qfp-solder-paste-10138012
Type:OtherPlace of Origin:Guangdong China (Mainland)Brand Name:ZhenxunModel Number:ZX-1600
Voltage:220VCurrent:10 ARated Capacity:4000 WRated Duty Cycle:350
Dimensions:L900*W830*H950mmWeight:150 KG,Approx. 150kgsUsage:remove and replace bga ,chipset,IC,QFN,CSP, QFP,POPPCB Size:Max L640*W470mm
PCB Thickness:0.1~5mmTemperature Control:K thermocouple PID Closed loopPCB Positioning mode:OuterBottom preheat:Infrared 2400 W
Top heater:800 WBottom heater:800 WPower supply:Single phase 220V,50/60Hz,4.6KVADimension:L900*W830*H950mm
ZX-1600 automatic optic alignment bga rework station touch screen repair pop qfn qfp solder paste
contact supplier for ZX-1600 automatic optic alignment bga rework station touch screen repair pop qfn qfp solder paste


ZX-1600 BGA rework station, solder paste

Features:

1. Embedded Windows system, PLC user interface control, optical alignment system, display 10 temperature profile at the same time, various of technology solutions, can meet customers different requirement;

2. Real-time profile to detect actual temperature profile, abnormal profile pre-alarm;

3. Auto height calculate and detect function, pickup tube intelligent pressure control system; 4. Pickup auto detect and alarm, pickup tube free angle auto control;

5. Temperature profile data analysis, can independent display and analysis any profile groups; 6. HD color optical alignment system, optical zoom up to 22 times;

7. When welding,with CCD camera to monitor the melting and welding of solder ball;

8. Upper heater with hot air, bottom with hot air and IR to preheat;

9. Three independent heater with 9 segment temperature up(down)+9 segment constant control, can store N groups temperature profile;

10. Reserved Nitrogen interface, rework process in the protection of Nitrogen;

11. Equipped with various size of hot air nozzle, heater can 360 degree rotation, easy to replace.

SPECIFICATION:

PCB SizeMax L640*W470mm
PCB Thickness0.1~5mm
Angle fine-tuning360°
Temperature ControlK Sensor Closed loop
Fine-tuning accuracy0.01mm
PCB PositioningOuter
Sub (Bottom) heaterInfrared 2400W
Main (Top) heaterHot air 1000W+800W
Power SupplySingle phase 220V,50/60Hz,5.0KVA
Machine dimensionL900*W830*H950mm
Weight of machineApprox. 150kgs

ZX-1600 automatic optic alignment bga rework station touch screen repair pop qfn qfp solder paste
Packaging Detail:Standard wooden package1 PC machine per one boxPackage size: L1000 * W930 * H1150 mm Package weight: 180 KGS
Delivery Detail:3 day

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