Home  >  Metal Processing Machinery  >  Machine Tool Equipment  >  Welding Equipment  >  Other Welding Equipment

bga rework station for laptop motherboard, - can repair 50x50mm chips, - infrared heating, - easy and SAFE operate, - CE - details see: https://www.machineto.com/t870a-bga-rework-station-repair-part-for-samsung-galaxy-s2-motherboard-new-bga-reballing-machine-soldering-welding-taian-puhui-10138280

T870A BGA rework station/repair part for samsung galaxy s2 motherboard/new bga reballing machine,soldering,welding,taian,puhui

Technical parameters

Power: 1000W

Voltage: AC110V-220V 50/60HZ

Infrared lamp body power: 150W

Preheating plate power: 800W

Working bench size: 360*240mm

Infrared lamp body heating size: 50*50mm

Preheating plate size: 240*180mm

Preheating plate temperature range: 60-200C

Infrared lamp body temperature range: 200-450C

Features:

1. Infrared welding technology .

2. Infrared heating, can avoid the IC damage due to the fast or uninterrupted heating up.

3. Easy operate; user can operate skillfully after one-day training.

4. No need welding tools, it can weld any chips under 50mm.

5. With 800W hot melt system, preheating range 240*180mm.

6. It doesn’t impact the smart parts without hot air, and suits to weld BGA, SMD, CSP, LGA, QFP, PLCC and BGA reballing.

7. It suits for a variety of computer, notebook, play station’s BGA components, especially in a Northbridge/ Southbridge chipset of computer.