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BGA rework station (SV550), 3 heaters, Semi-auto machine with vision, Industrial computer system, Electri-motor controlled - details see: https://www.machineto.com/sv550-bga-rework-station-10368782

BGA Rework Station (SV550)

Specification

PCB dimension: W20×D20~W450×D450mm
PCB thickness: 0.5~4mm

BGA dimension: 1×1~70×70mm
Working table adjustment: ±10mm forward/backward, ±10mm left/right
Temperature control: K-type thermocouple, close cycle controlled
PCB locating way: Outer or Jig
Bottom Pre-heater: infrared, 3000W
Nozzle heater: hot air, 500W
Power supply: single-phase 220V, 50/60Hz, 3.5KW
Machine Dimension: L700×W650×H800mm
Weight: Appox. 120kgs

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Features

* Air flow and temperature is adjustable in a wide range to form high temperature breeze;

* The movable heating head is easy to operate; hot air head and mounting head are manually

controlled;PCB sliding rack is micro-adjustable with X and Y axes;

* Color optical system with functions such as split vision, zoom in and micro-adjustment,

autofocus and menu operation, and with aberration detecting device;

* Color LCD monitor;

* Touch screen interface, PLC control; able to display temperature curves and two detecting

curves at the same time;

* Two independent heating areas, temperature and time are digitally displayed;

* Over-heating protection for the hot air heating head; temperature of hot air in the upper and

infrared at the bottom is program controllable; with 6 segments of temperature up (down) and

6 segments constant temperature control, 50 groups of temperature curve are stored; Curve

analysis can be carried out on the touchscreen;curve are stored; with computer

communication function as computers ,with communication software attached; with

temperature measurement function;

* The supports for the BGA soldering supporting frame are micro-adjustable to restrain local

sinkage in the soldering area;

* Suction force of the in-built vacuum pump is adjustable; 360° rotation in angle; mounting

nozzle is micro-adjustable;

* Over-heating protection for the upper hot air heating head;

* Versatile device for aplinting PCB suitable for different board;

* Large IR pre-heating from the bottom, made of imported high quality heater, will heat the

PCB evenly to avoid deformation and keep solder effect; heating board is independent

controlled;

* Equipped with different alloy hot air nozzles (customizable), easy to replace;