Small wave solder machine LF230A/Mini wave solder machine/Lead free wave solder
Type:Soldering Machine | Condition:New | Place of Origin:Beijing China (Mainland) | Brand Name:Glichn |
Model Number:LF230A | Rated Capacity:85Kg | Voltage:220V 50~60Hz | Dimensions:PCB Size 200 * 260 mm (300mm ordered) |
Weight:128KG | Certification:CE/ROHS/CCC | Usage:soldering pcb | Model:benchtop wave soldering machine |
Solder way:Spray/Foam | Solder method:lead free/lead solder | Solder capatity:40--85kg (make by order) | PCB size:200*260mm (make by order) |
Power(W):3 KW | Dimension(L*W*H):900 * 668* 580mm | Warranty:1 year |
Wave Soldering Machine LF230A
Lead Free bench top compact wave soldering machine, low capacity titanium solder pot of 85kg, high performance shot light preheat and reliable foam flux.
PCB size 200mm ( Width ) x 260mm ( Length ) with output approx 200 boards per 8 hours .
Features
1 Easy operation and control;
2 Solder temperature and time are digital display on the controlling panel;
3 High temperature heat elements are in the machine to ensure wave solder stable performance and best reliability.
4 Wave solder machines with bench top and lead free are widely application. The unit has replaced iron and dip solder furnace to do soldering in small-middle batch production.
5 PCB productions are up to 200 pcs within 8 hours, high efficiency in university, research and design factory.
High efficiency: Reasonable price, long life Small size and low power consumption.
6 Titanium pot for lead free soldering is advance and environmental; Long use life and best price;
7 Small dimension, saving space, the best choice for research and low volume production.
Adjustable Titanium Finger Conveyor
Adjustable carrier, with titanium fingers on pallet automatically indexes boards on chain-drive conveyor.
Pallets are available for Multi-piece small boards to process soldering.
Foam Flux
Integrated automatically activated foam flux with adjustable wave height.
Whole soldering process
PCB boards move downward to flux and preheat, then it will reverse to solder and cool-down. The board wave soldering is completed and load new board.
Specification
Model | Bench top lead free wave LF230 |
Max power consumption | 3Kw |
Solder pot capacity | 40--85Kg (make by order) |
PCB Size | 200 * 260 mm (It can be made by order) |
Solder temperature range | Room~300°Cadjustable |
Preheat Temperature range | 90~130°C |
Wave height adjust range | 5~ 12mm |
Melt time | 60min |
Flux spray | Foam spray |
Power supply | AC 220V 50HZ |
Conveyor speed | 0.5~ 2 m /min |
Dimension | 900 * 668* 580mm |
Weight | Approx 110kg |
Packing | Exemption wooden packing |
Packing size | L110* W800 * H700mm |
Packaging Detail:Export wooden packing. |
Delivery Detail:10 working days |