Semi automatical reflow laptop BGA Machine ZM-R6810 Soldering BGA Station Rework game board BGA machine Repair Chip machine

1,Repair chip machine, 2,Panasonic PLC, 3,Hot air&infrared heater, 4,Rework bga machine, 5,Repair laptop BGA Machine - details see: https://www.machineto.com/semi-automatical-reflow-laptop-bga-machine-zm-r6810-soldering-bga-station-rework-game-board-bga-machine-repair-chip-machine-10138032
Type:Reflow SolderPlace of Origin:Guangdong China (Mainland)Brand Name:ZHUOMAO(ZM)/SeamarkzmModel Number:ZM-R6810 Repair chip machine
Usage:Repair chip machineVoltage:220VWeight:75KGDimensions:L85*W83*H80 cm3
Rated Duty Cycle:100%Rated Capacity:N/ACurrent:22ACertification:CE
After-sales Service Provided:Engineers available to service machinery overseasCompany type:OEMFeature:Optical BGA StationAdvantage:precise temperature with Optical alignment vision system
repair chip type:BGA,CCGA,QFN,CSP.LGAWarranty:1 YearRepair:laptop computer xbox360 mobileFunction:Soldering BGA Station
Manufacturer experience:10 years   
Semi automatical reflow laptop BGA Machine ZM-R6810 Soldering BGA Station Rework game board BGA machine Repair Chip machine
contact supplier for Semi automatical reflow laptop BGA Machine ZM-R6810 Soldering BGA Station Rework game board BGA machine Repair Chip machine


Item: ZM-R6810 Optical Soldering BGA Station, repair all SMT chip machine

Semi automatical BGA rework station, optical repair BGA machine, laser BGA Soldering machine,Desoldering BGA machine, BGA FIx, Remove/mount/weld BGA Chip of laptop, xbox360 and mobile motherboard.

Seamarkzm produce BGA Rework station with 10 years experience.

Usage: It could remove, desolder, solder, weld computer, laptop,xbox360 and mobile BGA Chip. such as GPU, CPU, south bridge, north bridge. even for lead free BGA Chip.

Main Features

1. Optical BGA Station with Touch screen operation, show hot air and infrared heaters temperature curves.

2. Temperature controlled within 2 degree

3. Panasonic servo system,Semi automatical optical alignment vision system

4, Panasonic PLC.

5. semi automatically remove,mount,welding bga chip of laptop, xbox360 and mobile motherboard.

Solder BGA Station specifications and technical parameters

1

Total Power

6750W

2

Top heater

1200W

3

Bottom heater

2ndheater 1200W,3rdIR heater 4200W

4

power

AC220V±10% 50/60Hz

5

Dimensions

L900*W680*H900 mm

6

Positioning

V-groove, PCB support can be adjusted in any direction and with external universal fixture

7

Temperature

control

K-type thermocouple (Closed Loop), heating independently, temperature precision within ±2 degree

8

PCB size

Max 400*450mm Min 10*20 mm

9

Electrical

materials

Servo Drive( Panasonic)+Touch screen( Taiwan)+Panasonic PLC+Heating plate(Germany)

10

Camera

magnification

10x-100x

11

Optical system

Japanese original high-definition CCD color imaging system

12

BGA chip

1×1-80×80mm

13

Touch screen

7.0', Resolution 640X480, Panel Visa touch screen, external USB interface

14

External temperature sensor

Four

15

Work Mode

Power drive

16

Placement Accuracy

X, Y axis and the R angle with micrometer adjust, accuracy within ± 0.01MM

17

Net weight

85kg

3, Heaters and interface

4, Optical Alignment

5,Laser position

6,Operation detail

7, Touch screen

If any idea, welcome to contact me!

Certfication:

Factory photos

Semi automatical reflow laptop BGA Machine ZM-R6810 Soldering BGA Station Rework game board BGA machine Repair Chip machine
Packaging Detail:Semi automatical ZM-R6810 optical BGA Station1,Standard Wooden case2, Package Dimension:L110*W112*H98cm.3,G.W. is 160KG
Delivery Detail:1-3 workdays after PO

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