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Full-auto BGA rework system, 30 X optical zoom, Nozzle can identify material and mounting height autoly, Movable heating head - details see: https://www.machineto.com/rw-e500a-highly-technic-chipset-remove-replace-job-for-mobiles-laptop-xbox360-ps2-3-bga-rework-station-10137972

(RW-E500A)highly technic chipset remove&replace job for mobiles,laptop,xbox360,ps2/3 BGA rework station

Specification:

PCB dimension: W20×20~W600×W500mm
PCB thickness: 0.5~4mm
Working table adjustment: ±10mm forward/backward, ±10mm left/right
Temperature control: K-type thermocouple, close loop controlled
PCB locating way: Outer or jig
Preheater: far infrared, 6000W
Upper heater: hot air, 1000W
Lower heater: hot air, 1000W
Power supply: single-phase 380V, 50/60Hz, 10KW
Machine dimension: L1350×W800×H1800mm
Air supply: 5~8kgf/cm², 60L/min
Weight: Appox. 180Kgs

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Features:

* Hot air head and mounting head are designed 2 in 1, and, can store 20 groups of working

locations, with the precision to 0.02mm;

* Driven by X and Y axes step motor, operated with rocker bar , micro-movable when

approaching the destination; able to store 20 groups of data;

* Color optical system with functions of split vision, zoom-in and micro-adjustment, equipped

with abbreviation detection device, auto focus, software operation,; 30X optical zoom; able

to rework BGA sized up to 70mm×70mm;

* Touch screen interface, PLC control;real-time temperature curve display; able to display

temperature curves and five detecting curves at the same time;

* Color LCD monitor;

* Suction nozzle can identify automatically material and mounting height, can constrain the

pressure within a small range;

* Connected with nitrogen outsdie for nitrogen-protected soldering and desoldering;

* Build-in vacuum pump; 360° rotation in Φ angle; mounting nozzle is micro-adjustable;

* The supports rock can be adjusted to restrain the local sinkage of the BGA soldering area;

* 8 segments of temperature up (down) and 8 segments constant temperature control, 50

groups of temperature curve are stored; curve analysis can be carried out on the touch

screen;with computer communication function, communication software is attached;

* Three independent heating areas, temperature and time can be displayed digitally on the

touch screen; can rework CGA;

* Both upper and lower hot-air heating heads are movalbe on the IR preheating area to fit for

reworking BGA in different positions on PCB;

* With function of protecting from lack of air pressure;

* Control independently through external computer, and finish all functions;

* Automatically pick-up BGA for soldering&desoldering and place BGA to the appointed

position;

* Large IR pre-heating from the bottom will heat the PCB evenly to avoid deformation and

keep soldering effect; heating board is independently controlled;

* Equipped with different alloy hot air nozzles, easy to replace; be able to locate in any angle.