(RW-B400C) Laptop/desktop BGA Chip repair machine

rework station:, 1.three heaters ,with USB port, 2.touch screen,siemens PLC Control, 3.99% working after rework, 4.laptop repair - details see: https://www.machineto.com/rw-b400c-laptop-desktop-bga-chip-repair-machine-10136354
Place of Origin:Guangdong China (Mainland)Brand Name:ShuttlestarModel Number:RW-B400CDimensions:660mm (L) 630mm (W) 600mm (H)
Voltage:220VWeight:Appox 60kgsUsage:BGA reworkColor:Black
PCB Dimension:W50*D50-W450*D400mmPCB Thickness:0.5-4mmMachine dimension:L660*W630*H600mm 
(RW-B400C) Laptop/desktop BGA Chip repair machine
contact supplier for (RW-B400C) Laptop/desktop BGA Chip repair machine


warranty:

1 year, in the warranty, if any parts are broken not artificially, our company will afford to replace a new one for you and the relative shipping cost is on our party.

(RW-B400C) Laptop/desktop BGA Chip repair machine

Specification:

BGA rework station (RW-B400C)

PCB dimensionW50*50~W450*400mm
PCB thickness0.5~4mm
Working table adjustment+/-50mmforward/backward,+/-200mm left/right
Temperature controlK-type thermocouple, close cycle controlled
PCB locating wayJip
Area heaterInfrared 2700w
Top heaterHot gas 400w
Bottom preheatHot gas 800w
Power supplySingle-phase 220,50/60Hz. 4.5kw
Machine dimensionL660*W630*H600mm
Machine weightApprox. 60kgs

Package list :

1. BGA rework station RW-B400C--------------1 PCS

Accessories :

Nozzles ----------------------------------------------------5 pcs (44, 41, 38, 31, 26 mm, 1pc for each size)
Tools box -------------------------------------------------1 pcs
Inside the hexangular wrench ----------------------1 set
Clamp for Motherbord----------------------------------1 set
Brush-------------------------------------------------------1 pcs
USB mouse ----------------------------------------------1 pcs
Vacumm IC pikcer---------------------------------------1 pcs
Aluminium plate for BGA IC reballing -------------1 pcs
Thermo sensor wire(High precision) -------------1 pcs
Reballing stencils holder -----------------------------1 pcs
Reballing stencils --------------------------------------33 pcs
0.5 /0.6/0.76mm leaded solder balls---------------3 bottles (1 bottle for each size , 250k/bottle)
English manual ------------------------------------------1 book

Upper Nozzle

(RW-B400C) Laptop/desktop BGA Chip repair machine
Packaging Detail:packed with ploywooden case;free of fumigation.Gross weight after packing:60package;dimension:82*72*72cm
Delivery Detail:within 5-10 working days

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