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1.smd rework soldering station, 2.Semi-automatic equipment, 3.Suit any BGA chip repair, 4.CE,ISO passed, 5.Operation precise - details see: https://www.machineto.com/optical-alignment-smd-rework-soldering-station-zm-r6100-xbox-ps3-solution-bga-rework-station-10137991

1.smd rework soldering station
2.Semi-automatic equipment
3.Suit any BGA chip repair
4.CE,ISO passed
5.Operation precise

SHENZHEN ZHUOMAO TECHNOLOGY CO., LTD

First Parameters:

1	Total Power	4850W
2	Top heater	800W
3	Bottom heater	2ndheater 1200W, 3rdIR heater 2700W
4	power	AC220V±10% 50/60Hz
5	Dimensions	850*830*800 mm
6	Positioning	V-groove PCB support with external universal fixture
7	Temperature control	K-type thermocouple (Closed Loop), temperature precision within ±2 degree
8	PCB size	Max 370×450mm Min 22×22mm
9	Electrical materials	touch screen + PLC + heating plate + module
10	Camera magnification	3-54×
11	Optical system	CCD color imaging system
12	BGA chip	2×2-80×80mm
13	Touch screen	7.0 inch, Resolution 640X480, Panel Visa touch screen
14	External sensor line	One(optional)
15	Placement Accuracy	X, Y axis and the R angle with micrometer adjust, accuracy within ± 0.01MM
16	Net weight	70kg

Second Features:

1, top and bottom heaters are hot air heating, and heat the PCB at the same time, the IR preheating

area is infrared heating, temperature accuracy within C, the top and bottom heaters can set 6

segments .

2, it can heat PCB board and bga chips at the same time. And the third IR heater can preheat the

PCB board from bottom, to avoid PCB from deformation during repair process. The top and bottom

heaters heat independently;

3, K type close loop thermocouple, and PID parameters automatic adjustment system;show seven

temperature curves at the same time and save many groups data,with instant curves analysis functi

-on and analyzing BGA temperature at any time; the sensor is for precise temperature testing.

4, Adopt high definition human machine interface, available for setting “set up” and “operate”

to avoid error settings, The top heater device and mounting head 2 in 1 design, with automatic iden

tify BGA chips and mounting height, it is of automatic soldering and desoldering function. Adopted

all kinds of BGA nozzles, with 360° rotation, easy for installation and replacement, customized is a

-vailable;

5, Without changing the magnification, the optical lens can be moved back and forth freely. It can

observe all aspects of the BGA chip. It displays clearly. The X, Y axis and R angle with micrometer

adjust, precise positioning, alignment accuracy is within ± 0.025MM.

6, V groove PCB support, with rapid, convenient and accurat positioning, can fit for all kinds of PCB

board; Flexible and removable universal fixture has protective effects and no damage to the PCB b

-oard, suitable for all kinds of sizes of BGA repair.