New big BGA reballing machine

1. New big BGA reballing machine, 2. Infrared bga rework station, 3. Total Power 6800W - details see: https://www.machineto.com/new-big-bga-reballing-machine-10137796
Place of Origin:Guangdong China (Mainland)Brand Name:ZhuomaoModel Number:R6821Voltage:220V
Current:50/60mhzDimensions:890x790x1000mmWeight:130kgUsage:repair bga IC or mainboard
Type:Soldering Machine   
New big BGA reballing machine
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New big BGA reballing machine

Automatic alignment ZM-R6821 Bga rework station

Specifications

1 Power consumption 5800W
2 Top heater 800W
3 Bottom heater Infrared plate 4200 W - Nozzle 800 W
4 Power requirement Single phase AC 220V ± 10% - 50 Hz – 5.8 kVA
5 Dimensions L800×W700×H1000mm
6 Positioning V-clip PCB clamping | 10~20 μm X-Y table adjust.
7 Temperature control Imported K-type thermocouple (Closed Loop) ±3-5°C
8 PCB size 22×22mm to 400×450mm
9 Camera magnification 10x to 100x
10 Weight 130 kg

Features:Features:
1. This touch screen controlled desktop rework station is the most compact of our high range equipment. Password protects the data. The temperature profile chart can show 7 profiles at any time.
2. With 5 high precision thermocouple, the temperature can be precisely controlled within a 2°C range by the PLC.
3. With 6 programmable temperature zones, preheat, ramp up, reflow, solidification and cooling can be precisely adjusted.
4. 100 profiles can be recorded within the machine and flexibly created and modified through the touch screen interface.
5. Heating and placing head’s unique combined design, allows flawless placing and soldering. X,Y and Z axis are driven by step-motors. The software can remember 100 groups of coordinates.
6. The 3 temperature zones are controlled independently by the software. Preheating the PCB with infrared plates can avoid deformation and guarantees precision of soldering.
7. Use a powerful cross-flow fan to cool PCB rapidly to prevent it from deformation and ensure the welding effect.
8. Use a V-groove equipped with a flexible fixture for PCB positioning to protect the PCB.
9. The touch screen controls the upper heating system and the optical device. Is is very easy to operate.
10. The top and bottom heating head can move freely on the infrared plate so that BGA can be repaired on different areas of PCB.
11. The machine is equipped with Japan imported vacuum pump.
12. The CCD camera can simultaneously observe the component picked up by the nozzle and the pad on the PCB. The color sensitive focal positioning system can achieve a matching accuracy of 10 to 20 µm.
13. The operator can supervise the process on a split screen 17” monitor.
14. The high degree of automation achieved with this model minimizes the risk of human error.
15. This equipment completely meets the requirements of lead-free process.

New big BGA reballing machine
Packaging Detail:wooden carton
Delivery Detail:in 4-5 days after confirm the payment

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