Lowest price GM-5260 mobile motherboard repairing
1.mobile motherboard repairing, 2.Lowest price with high quality, 3.Easy operation, 4.with CE certificate - details see: https://www.machineto.com/lowest-price-gm-5260-mobile-motherboard-repairing-10138077
Type:Other | Place of Origin:Guangdong China (Mainland) | Brand Name:GMAX | Model Number:GM-5260 |
Voltage:220V | Current:24A | Rated Capacity:4300W | Rated Duty Cycle:N/A |
Dimensions:600*600*780mm | Weight:55KG | Usage:repair BGA/SOCKET, desoldering, soldering.etc | Certification:CE,ISO |
After-sales Service Provided:Engineers available to service machinery overseas | Name:mobile motherboard repairing | Power supply:AC 220V 50/60Hz 4300W | Color:Black |
Size of PCB:Max420*350mm,Min 10*10mm | Size of BGA:2*2mm-80*80mm | Heater:3 independent heaters | Temperature control accuracy:more or less 1 celcius |
Process Control:Automatic welding and desoldering | OEM&ODM:Acceptable |
Category | Items | Specifications |
Temperature control system | The Number of Heater | 3 independent heaters, top heater, bottom heater, IR heater |
The Power of Heater | Power of top heater: 1000W Power of bottom heater: 1000W Power of IR heater: 1000W | |
Heating Method | The 1st and 2nd hot-air heaters, no requires an external source of air, the Speed of fan is controlled by software. | |
Temperaturecontrol algorithm | High-precision K-type thermocouple with close-loop control, PID auto-tuning system temperature system. | |
Temperaturecontrol accuracy | ±1°C | |
The number of temperature curve | Magnanimity | |
analysis oftemperature curve | Supportautomatic analysis of the result of temperature curve | |
The number of external temperature test interfaces | 4(Extensible) | |
Optical vision system | Alignment | Optical alignment system, driven by step motor |
Accuracy | ±0.01mm | |
Camera | High-definition CCD color optical vision system, provide the function of zoom and auto-focus | |
Illumination | LED background color light source, clearer BGA images | |
Micro-adjustment | The X, Y axis and θ angle fine adjusted with micrometer | |
Size of PCB and BGA | Size of PCB | Max 420X350mm ,Min 10X10mm |
Size of BGA | 2X2mm—80X80mm | |
The scheme of clamping PCB | V-groove, PCB support, rapid positioning, convenience, accuracy, can fit for all kinds of PCB. | |
The Method ofsuck BGA | The build in vacuum pump can automatically suck BGA chip | |
Motion control | Drive mode | Driven by step motor |
Control mode | Automatic adjustment of speed and position based on parameters | |
Control system | Control mode | Industrial PC and intelligent industrial control module |
Control interface | Humanized multifunctional operation interface based on Windows XP | |
Process control | Intelligent control of the process of welding and desoldering, automatic welding and desoldering | |
Others | Dimensions | 700x600x780mm |
Weight | 90Kg | |
Power supply | AC220V±10% 50/60Hz 4400W AC220V±10% 50/60Hz 4400W |
Accessories
Accessories | Quantity | Remarks |
Top Nozzles | 4 | Accessories |
Bottom Nozzles | 1 | Accessories |
Bracket of special-shaped PCB | 4 | Accessories |
Type k thermocouple | 4 | Accessories |
Vacuum cups | 10 | Accessories |
Operation manual | 1 | Accessories |
Packaging Detail:Standard Wooden Packing |
Delivery Detail:Within 3 days after Payment |