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1.FD-6900C bga rework system, 2.hot air and IR PreHeat, 3.touch screen 3 temperature zone, 4.ccd camera, 5.monitor offer - details see: https://www.machineto.com/low-cost-fundar-fd-6900c-touch-screen-bga-rework-system-10137805

Low cost FUNDAR FD-6900C touch screen bga rework system

1. FD-6900C Main Functions

1. Embedded Industrial PC, high definition touch screen interface, PLC control, and instant profile analysis function. Real-time settings and actual temperature profile display can be used to analyzed and correct parameters if necessary.
2. It could watch the solder ball melt progress on the monitor, very useful, with camera you can see if the PCB flex or not and you can see when the solder start to solder.
3. It uses precise K-type close circuit control and automatic temperature adjustment system, with PLC and temperature module to enable precision temperature control of ±2 deg C. External temperature sensor enables temperature monitoring and accurate analysis of real time temperature profile.
4. V-groove PCB supports for rapid, convenience and accurate positioning that fits for all kinds of PCB board.
5. Flexible and convenient removable fixture on the PCB board which protects and prevent damage to PCB. It can also adapt to rework various BGA packages.
6. Various sizes of BGA nozzles, which can be adjusted 360 degree for easy installation and replacement;
7. Three temperature areas can independently heat and are multiple controllable and adjustable to ensure best integration of different temperature areas. Heating temperature, time, angle, cooling and vacuuming can all be set on the interface.
8. There are 6-8 levels of variable and constant temperature controls. Massive storage of temperature curves which are Instant accessible according to different BGA. Curve analysis, setting and adjustment are all accessible via touch screen. Three heating areas adopt independent PID calculation to control heating process to enable more accurate and precise temperature control.
9. It uses high powered blower to enable fast cooling of PCB board and prevent it from deformation. There are also internal vacuum pump and external vacuum pen to assist with fetching the BGA chip.
10. Including Voice "early warning" function. 5-10 seconds before the completion of uninstalling or welding, voice reminder / warning to get the workers prepared. Cooling system will start after vertical wind stopped heating. When the temperature drops to room temperature, the cooling process will stop, so that the machine will not age after heated up.
11. CE certification, with emergency switch and automatic power-off protection device when emergency happens.

2. BGA Rework Station Technical Parameters

Total Power	4800W
Top heater	800W
Bottom heater	2nd heater 1200W, 3rd IR heater 2700W
Temperature Zones	Three Zones
Voltage	AC220V±10%, 50/60Hz
Positioning	V-groove with external universal fixture
Temperature control	K Sensor Closed loop, heating independently
Temp accuracy	±2°C
Temperature control Settings	6-8 levels of variable(up/down) and constant temperature controls, Massive storage of temperature curves
PCB size	Max 500×400 mm Min 22×22 mm
BGA chip	2×2-80×80mm
Minimum chip spacing	0.15mm
External Temperature Sensor	1pcs (optional)
vacuum system	Support, internal vacuum pump and external vacuum pen
Touch screen	7.0 inch, HD Resolution, Panel Visa touch screen
Camera magnification	HD Resolution, 3-54×
Optical system	CCD color high-definition imaging system, manually
Monitor	15 Inch
Electrical materials	Taiwan touch screen + PLC + heating plate(Germany)+high precision intelligent temperature control module
Dimensions	L800×W900×H950 mm
Net weight	45kg