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full-auto BGA repair RW-E6250, Color LCD monitor, movable heaters&Cam., use air compressor;, developed for Cisco Server - details see: https://www.machineto.com/full-auto-bga-repair-rw-e6250-10137980

Full-auto BGA Repair RW-E6250

Specification

PCB dimension: W20×20~W450×W400mm

PCB thickness: 0.5~4mm
Applicable chip size: 1×1~70×70mm

PCB locating way: outer or jig

Working table adjustment: ±10mm forward/backward, ±10mm left/right
Temperature control: K-type thermocouple, close cycle controlled
Preheater: far infrared, 6000W

Top heater: hot air,1000W
Bottom heater: hot air, 1000W
Power supply: single-phase 220V, 50/60Hz, 6KW

Air supply: 5~8kgf/cm²,60L/min
Machine dimension: L850×W700×H950mm

Weight: Approx.150Kgs

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Description

* Hot air head and mounting head are designed 2 in 1, and have both the auto soldering and

mounting function;
* Color optical system with functions of split vision, zoom - in and micro-

adjustment,equipped with aberration detection device; with auto focus and software

operation function,22X optical zoom; able to rework BGA sized up to 70mm×70mm;
* Touch screen interface, PLC control; able to display temperature curves and five detecting

curves at the same time;
* Color LCD monitor;
* Built-in vacuum pump; 360° rotation in Φ angle; mounting nozzle is micro-adjustable;
* 6 segments of temperature up (down) and 6 segments constant temperature control, 200

groups of temperature curve are stored; Curve analysis can be carried out on the touch

screen and has the communication function as computers ,with software attached;
* Able to arrive at three independent temperature zones,temperature and time can be

displayed digitally on the touch screen;able to rework CGA;
* The supports rack can be adjusted to restrain the local sinkage of the BGA soldering area;
* Suction nozzle can identify material and mounting height automatically, and can control the

air pressure within a small range;
* Both upper and lower hot-air heating head are movable on the IR preheating area to fit for

reworking BGA in different positions on PCB;
* Equipped with different alloy hot air nozzles, easy to replace and able to locate in any angle.
* Driven by the servo motor,the integrative hot air head can store 20 groups of different BGA

heating points and register marks.