BGA Rework station ZM-R5830 Repair computer BGA Machine Solder xbox360 Station Gameboard repair machine
1.Gameboard Repair machine, 2.touch screen, 3.independent heating, 4.stable temperature., 5,9 years experience. - details see: https://www.machineto.com/bga-rework-station-zm-r5830-repair-computer-bga-machine-solder-xbox360-station-gameboard-repair-machine-10138181
Type:Reflow Solder | Place of Origin:Guangdong China (Mainland) | Brand Name:ZHUOMAO(ZM) | Model Number:ZM-R5830 Gameboard repair machine |
Usage:BGA Machine,BGA Machine for laptop xbox360 mobile | Voltage:220V | Weight:40KG | Dimensions:L635*W600*H560mm |
Rated Duty Cycle:100% | Rated Capacity:no battery | Current:22A | Certification:CE,ISO&CE |
After-sales Service Provided:Engineers available to service machinery overseas | Function:Gameboard repair machine | Business type:Manufacturer | Feature:hot air heater infrared heater and touch screen |
Warranty:1 year | G.W.:51KG. | Package dimension:L71*W71*H68cm | Experience:10 years |
Customized service:Available |
Item: HOT Economical ZM-R5830 Gameboard repair machine
Usage: Desolder,remove, mount, solder Laptop,desktop computer,xbox360,psp,ps2 and mobile BGA Chip, such as CPU, GPU, south bridge, north bridge etc. even for lead free BGA Chip.
1, Main Feature
1. BGA machine with Touch screen operation
2. remove/mount/weld bga chip
3. independent heating
4. Repair laptop, xbox360, mobile
5,top and bottom Hotair& 3rd infrared heaters
6, over heating protection
2, Specifications and Technical parameters
1 | Total Power | 4500W |
2 | Top heater | 800W |
3 | Bottom heater | 2ndheater 1200W,3rdIR heater 2400W |
4 | power | AC220V±10% 50/60Hz |
5 | Dimensions | L535*W650*H600 mm |
6 | Positioning | V-groove, PCB support can be adjusted in any direction and with external universal fixture |
7 | Temperature control | K-type thermocouple (Closed Loop), heating independently, temperature precision within ±3 degree |
8 | PCB size | Max 350*330mm Min 20*20mm |
9 | Electrical materials | Taiwan touch screen + Delta PLC + high precision intelligent temperature control module |
10 | Net weight | 34KG |
3, ZM-R5830 Repair laptop motherboard photos:
4,Certifications: CE and ISO9001:2009
5,Factory photos:
Packaging Detail:ZM-R5830 BGA Machine package details as following:1,Standard Wooden Case 2,Dimension:L71*W71*H68cm.3.GW:68KG |
Delivery Detail:1-2 workdays after payment |