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BGA rework:, PLC control, color monitor,3 heaters and touch screen;, repair laptop , XBOX , PS3;, with optical alignment system; - details see: https://www.machineto.com/bga-rework-rw-sv520-10138056

BGA rework station RW-SV520

Warranty:

one year, in warranty, if any parts are broken not artificailly, we will replace a new one for you and the shipping cost is on our party.

Specification

Upper heater:	hot-air 600W
Lower heater	hot-air 800W
Bottom preheat	far infrared, 2700W
Power supply	single-phase 220V,50/60Hz,4.5KW
Workable PCB dimension	W20xD20~W450xD400mm
Workable PCB thickness	0.5mm ~ 3mm
Workable BGA dimension	1x1mm ~ 70x70mm
Min pitch of BGA ball	0.15mm
Placement precision	0.01mm
Max BGA weight	300g
Machine dimension	L700×W600×H800mm
Weight	Approx. 110Kgs

Features

1. The movable heating head is easy to operate; hot air head and mounting head are manually controlled; PCB sliding rack is micro-adjustable with X and Y ases;
2. Color optical system with functions such as spilt vision, zoom-in and micro-adjust, autofocus and menu operation, equipped with aberration detection device;
3. Embedded industrial computer can analyze the two practically-tested profiles, and compare them with the history saved profiles;profile saving no limit for the industrial computer
4. Color LCD monitor, touch screen interface;
5. Three heaters heating independently, both upper and lower heater can control multi stages on the profile simultaneously, large bottom IR heating area to heat PCB evenly; temperature, time, rate, cooling and alarm events are all displayed on the touch screen;
6. Over-heating protection for the hot air heating head; temperature of hot air in the upper and infrared at the bottom is program controllable; 8segments of temperature up(down) and 8 segments constant temperature control, profile saving is unlimited in the industrial computer; profile analysis can be carried out on the touch screen; with computer communication function as computers, with communication software attached; with temperature measurement function;
7. The supports for the BGA soldering supporting frame are micro-adjustable to restrain local sinkage in the soldering area;
8. Built-in vacuum pump;360 rotating inφ angle mounting nozzle is micro-adjustable.
9. Large IR pre-heating from the bottom, made of imported high quality heater, will heat the PCB evenly to avoid deformation and keep solder effect; heating board is independently controlled;
10. Equipped with different hot air nozzles, easy to replace and able to locate in any angle.
11. Can handle 775 socket, 478 socket, XBOX360, PS2/3, PSP etc.