BD-COG80 Bonding Machine

BD-COG80 Bonding machine is used to surface mount the IC with high accuracy of micro spacing on the glass substrate. - details see: https://www.machineto.com/bd-cog80-bonding-machine-10059107
Condition:UsedPlace of Origin:China (Mainland)Brand Name:ETmadeModel Number:BD-COG80
color:silveryDriven Type:PneumaticPackaging Material:WOODUsage:Outer
Automatic Grade:Semi-AutomaticType:General,Laminating Machine,Sealing Machine  
BD-COG80 Bonding Machine
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Features;

Specifications ;

ItemSpecification
LCD size1~7 inch
IC sizeMax: 30(L) * 5(W) *1.0(T) Min: 4(L) * 1(W) *0.4(T)
Number of indenters3
Pallet Size2*43*34*2
Welding spacingMin: 20um
Bonding accuracyPre-press precision: ) Main press precision: )
Imagery processing systemVisual search gray 2pcs 1/3B/W CCD, 6Xlens image registration 15LCD image display
Pre-press pressure1kgf~10kgf, adjust the cylinder pressure by the pressure regulating valve
Main press Pressure2kgf~49kgf, adjust the cylinder pressure by the pressure regulating valve
Pre-pressing heating temperature scopeConstant temperature heating(RT~120 may be set by taking 1 as the unit)
Main pressing heating temperature scopeConstant temperature heating(RT~350 may be set by taking 1 as the unit)
Power SupplyAC220V 50/60Hz 2000VA
Rating Power2000W
Air Supply0.5~0.7(MPa)
Request of Air supplyDrynessdust removaloil removal
Vacuum sourceVacuum pump equipped
Size1200(L) * 1000(W) * 1525(H)mm
Weight500kg
Work line height850mm
BD-COG80 Bonding Machine
Packaging Detail:Standard plywood case, free of fumigation
Delivery Detail:20 working days after PO or deposit

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