2013 Hot sale FUNDAR FD-6800 3 temperature zones hot air infrared bga rework machine

1.FUNDAR FD-6800 hot air infrared bga rework machine, 2.3 temperature zones, 3.connected pc control, 4.hot air IR preheating - details see: https://www.machineto.com/2013-hot-sale-fundar-fd-6800-3-temperature-zones-hot-air-infrared-bga-rework-machine-10137408

Type:Other	Brand Name:FUNDAR	Model Number:FD-6800	Voltage:AC220V±10%, 50/60Hz/110V±10%
Current:50	Rated Capacity:4800W,4800W hot air 1200W IR 2700W	Rated Duty Cycle:100	Dimensions:L520W600H650 mm
Weight:45KG	Usage:BGA chip-level repairing IC reballing	temperature zones:3 zones top heat /bottom heat/IR pre-heat	PCB size:Max 450mm350mm Min22mm22mm
PC Connect:built-in VGA port to be connected to a computer	upper heater postion control:up down left right	PCB suport:Slide Guide Bracket	Temperature control:K Sensor Closed loop,heating independently
Temperature control Settings:8 levels of variable(up/down) and constant temperature controls	temperature curves:10 groups storage	Temp accuracy:± 2 ℃

1. Fundar FD-6800 Main Functions

1. This machine uses three temperature control with wind heating for the upper part and IR heating or wind heating for the lower part. Both parts have its individual temperature control with high precision temperature control panel which has 6 levels of temperature adjustments and can save up to 10 sets of temperature settings simultaneously. External temperature sensor enables timely control, adjust and managing every temperature data.

2. It uses precise K-type close circuit control and automatic temperature adjustment system, with temperature module to enable precision temperature control of±2 deg C. External temperature sensor enables temperaturemonitoring and accurate analysis of real time temperature profile.

3. V-groove PCB support for rapid, convenience and accurate positioning that fits for all kinds of PCB board

4. Flexible and convenient removable fixture on the PCB board which protects and prevent damage to PCB. It can also adapt to rework various BGA packages.

5. Various sizes of BGA nozzles, which can be adjusted 360 degree for easy installation and replacement.

6. 6 segment temperature up (down) +6 segment constant temperature control

7. Before the completion of uninstalling or welding, voice reminder / warning to get the workers prepared. After uninstalling or welding after uninstalling or welding, high capacity horizontal airflow fan manually or automatically cools down PCB to prevent PCB deformation and ensure quality of welding.

8. CE certification, with emergency switch and automatic power-off protection device when emergency happens.

2. BGA Rework Station Technical Parameters

Total Power	4800W
Top heater	Hot Air 800W
Bottom heater	IR 2700W & Hot Air 1200W
Temperature Zones	Three Zones
Voltage	AC220V±10%, 50/60Hz
Positioning	Outer
Temperature control	K Sensor Closed loop, heating independently
Temp accuracy	±2°C
Temperature control Settings	6 levels of variable(up/down) and constant temperature controls, 10 groups storage of temperature curves
PCB size	Max 450mm350mm Min22mm22mm
Size of Bottom heating	180 * 180mm heating size
Cooling	Cross-flow cooling fan to cooling the PCB
Reballing	With one 1pcs iron
Minimum chip spacing	0.15mm
External Temperature Sensor	1pcs (optional)
PC Connect	built-in VGA port to be connected to a computer
Dimensions	L520W600H650 mm
Net weight	45kg

3. Packing list

NO	Item	Specification	Unit	Qty
1	SMD BGA rework station	FD-6800	Set	1
2	Instruction manual	FD-6800	Copy	1
3	Hot-air nozzle	3131-4141	Pcs	3
4	Shaped clip		Pcs	6
5	Plum knob		Pcs	6
6	Cross-flow cooling fan		Pcs	1
7	Supporting screw		Pcs	8