multy ingot wire saw for solar cell wafer 0.10~0.16mm
Place of Origin:Gyeongsangnam-do South Korea | Brand Name:Guild Ind Co.,Ltd | Model Number:OKS-400D | Required Agent Type:munufacture |
Agent Number Limit:10 | Contract Period:1year |
Feature:
# Precision Control with Servo motor and sensor
# Precise Automatic Tension Control
# Excellent precision with high strength main roller
# Auto chucking of workpiece with hydraulic system
# Automatic control of slurry temperature
# No. of wafers per year > 2,000,000pcs
# Minimum thickness of wafer > 160
Technial Date
Workpiece Dimension- Max 220mm x 220mm x 400mm x 2pieces
Work Roller
Outer diameter x Groove width - 220±10mm x 460mm
Span - 530mm
Wire
Wire Diameter - 0.10mm~0.18mm
Reciprocation mechansim - Main spindle servo motor CW/CCW
Tension absorbing mechanism -
Wire speed - Max 16m/sec
Work Table
Slicing and feeding speed - 0~9m/m/min, Max 500mm/min
Slicing Control - Wire flexion control system
Cutting Agent - Standard wire with slurry, Diamond wire with water and additive
Power - 3 phase, 200A (max 80kw)
Machine dimension & weight - 2200 x 3450 x 2650mm & 12,000kg
Packaging Detail:Standard export wooden packing |
Delivery Detail:4months |