multy ingot wire saw for solar cell wafer 0.10~0.16mm

Highest yield for solar wafer slicing - details see: https://www.machineto.com/multy-ingot-wire-saw-for-solar-cell-wafer-0-10-0-16mm-10366535
Place of Origin:Gyeongsangnam-do South KoreaBrand Name:Guild Ind Co.,LtdModel Number:OKS-400DRequired Agent Type:munufacture
Agent Number Limit:10Contract Period:1year  
multy ingot wire saw for solar cell wafer 0.10~0.16mm
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Feature:

# Precision Control with Servo motor and sensor

# Precise Automatic Tension Control

# Excellent precision with high strength main roller

# Auto chucking of workpiece with hydraulic system

# Automatic control of slurry temperature

# No. of wafers per year > 2,000,000pcs

# Minimum thickness of wafer > 160

Technial Date

Workpiece Dimension- Max 220mm x 220mm x 400mm x 2pieces

Work Roller

Outer diameter x Groove width - 220±10mm x 460mm

Span - 530mm

Wire

Wire Diameter - 0.10mm~0.18mm

Reciprocation mechansim - Main spindle servo motor CW/CCW

Tension absorbing mechanism -

Wire speed - Max 16m/sec

Work Table

Slicing and feeding speed - 0~9m/m/min, Max 500mm/min

Slicing Control - Wire flexion control system

Cutting Agent - Standard wire with slurry, Diamond wire with water and additive

Power - 3 phase, 200A (max 80kw)

Machine dimension & weight - 2200 x 3450 x 2650mm & 12,000kg

multy ingot wire saw for solar cell wafer 0.10~0.16mm
Packaging Detail:Standard export wooden packing
Delivery Detail:4months

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